Four HG612s (two Rev.1s, two Rev. 2) hav been running almost continuously for the last two months. One of them periodically overheats. It reboots and then hangs at the bootloader. Once cooled it runs fine for a while.
The 6368 processor at the heart of the HG612 is in a BGA (ball grid array) package.
According to Wikipedia..
A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can. As with all surface mount devices, bending, due to a difference in coefficient of thermal expansion between PCB substrate and BGA (thermal stress), or flexing and vibration (mechanical stress) can cause the solder joints to fracture.
Thermal expansion issues can be overcome by matching the mechanical and thermal characteristics of the PCB to those of the package. Typically, plastic BGA devices more closely match the PCB thermal characteristics than ceramic devices.
Thermal stress of the solder ball joints in the 6368 is perhaps the main cause of faults of the HG612.
It would be interesting to keep log the core temperature in the Huawei. Maybe there are CPU registers like there are in an x86, holding real-time core thermal data but if so, Broadcom doesn't make the specs public.